Our PCIe 3.0 to 6.0 series connectors deliver ultra-high transmission rates up to 64 GT/s, ensuring superior signal integrity and stable performance for high-speed computing. Designed with high reliability, durability, and hot-plug capability, each connector undergoes rigorous testing in our automated production lines to guarantee consistent quality. We provide comprehensive OEM/ODM customization, covering both board-end and cable-end solutions. Widely used in AI servers, data centers, GPU accelerators, and industrial automation, our PCIe connectors enable secure, efficient, and high-bandwidth interconnections for next-generation systems. ShuangYi Precision — Powering Smarter Connections.
ShuangYi Precision — Powering Smarter Connections.
Why Choose Us:
• Free samples available for quality evaluation.
• Support for both OEM & ODM customization.
• Trade Terms: EXW, FOB, CIF, CPT, etc.
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This SAS 68-Pin 180° Solder-Type Female Connector is engineered for stable and efficient wire-to-connector soldering applications, supporting reliable high-speed signal transmission for SAS interface systems.
The contact area features ≥30µ" gold plating with ≥50µ" nickel underlayer, ensuring excellent electrical conductivity, corrosion resistance, and long-term durability.
Designed using high-temperature LCP UL94-V0 housing and C5191 phosphor-bronze terminals, this connector provides robust mechanical strength and thermal stability suitable for harsh industrial and automotive environments.
Its 180° solder-type configuration makes it ideal for custom wire harnesses, server transmission modules, storage equipment, PCB extensions, and applications requiring strong and stable soldering joints.
| Product Type | SAS 68-Pin Female Connector (Wire Solder Type, 180°) |
| Housing Material | LCP, Glass-Fiber Reinforced, Black, UL94-V0 |
| Terminal Material | Phosphor Bronze (C5191-H), t = 0.25 mm |
| Base & Cover Material | LCP G/F Black UL94-V0 |
| Plating – Nickel | ≥ 50µ" Nickel underplating |
| Plating – Gold (Contact Area) | ≥ 30µ" Gold |
| Plating – Tin (Wire Solder Area) | ≥ 80µ" Matte Tin |
| Operating Temperature | –20°C to +85°C |
| Rated Current / Voltage | 1.5A @ 40VAC |
| Contact Resistance | ≤ 30mΩ |
| Insulation Resistance | ≥ 1000MΩ |
| Withstand Voltage | 500VAC / 1 minute |
| Insertion Force | ≤ 59N |
| Withdrawal Force | ≥ 12N |
| Durability – PCB Side | 500 cycles |
| Durability – Cable Side | 25 cycles |
| Pin Pitch | 1.27mm |
| Environmental Compliance | HF + RoHS 2.0 |
| Special Notes | Terminal–wire soldering method coded as S1; structure design optimized to avoid deformation |
Apllication
1. Server & Storage Equipment
SAS HDD/SSD
RAID expansion cards
Storage backplanes
Data center servers
2. Communication & Networking Devices
Routers and switches
Edge computing devices
Telecom base stations
3. Industrial & Automation Systems
PLC controllers
Industrial IPC motherboards
Motion control modules
4. Automotive Electronics
ADAS data logging
Vehicle storage modules
Smart cockpit controllers
5. High-Density PCB Designs
Compact electronic systems
Multi-board interconnection modules
Notes
- Maintain clean, oil-free contact surfaces before soldering or mating.
- Use proper soldering temperature to avoid LCP housing deformation.
- Follow correct wire–terminal soldering angle and depth.
- Ensure wire gauge matches solder cup size for optimal bonding.
- Avoid excessive mechanical pulling to maintain long-term terminal strength.
- Keep connectors in dry, anti-static packaging during storage.
- Verify signal integrity requirements for SAS applications before wiring.
- Avoid pairing with heavily oxidized male connectors to prevent signal loss.
